Sony announced the commercialization of two new "Exmor R" back-illuminated CMOS image sensors with improved photographic performance including high sensitivity and low noise.
In addition, Sony will launch two new lens modules equipped with these image sensors, which also include the smallest and thinnest model for mobile phones. This is also the first time that "Exmor R" is commercialized for the use in mobile phones.
"IMX081PQ" is world’s first type 1/2.8 back-illuminated CMOS image sensor which realizes 16.41 effective megapixel resolution, and adopts the industry’s smallest unit pixel size of 1.12μm achieved by the fine pixel fabrication process technology. In theory, when a unit pixel size is made smaller, there are also some issues such as color mixture among smaller unit pixels. Sony said they solved this problem by implementing a “unique” formation of photo diodes optimally designed for fine pixel structure to realize a CMOS image sensor with high resolution, high sensitivity and low noise.
"IMX105PQ" is a type 1/3.2 back-illuminated CMOS image sensor which realizes 8.13 effective megapixel resolutions for higher sensitivity and adopts a unit pixel size of 1.4μm. By embedding these highly sensitive sensors into mobile phones, including those without camera flash, users can capture high quality photos and videos even in low light settings.
Furthermore, Sony will commercialize "IU081F" and "IU105F2" compact auto-focus lens modules which include the two new "Exmor R" back-illuminated CMOS image sensors. According to Sony, these down-sized modules are “suitable and efficient for mobile phones with relatively limited space and are equipped with high performance lens which maximize the image sensors’ respective performances.”
"IU081F" is the industry’s smallest and thinnest auto-focus lens module (W10.5 X D10.5 X H7.9mm) and is equipped with the 16.41 megapixel CMOS image sensor. "IU105F2" adopts the 8.13 effective megapixel CMOS image sensor, and belongs in the industry’s smallest and thinnest size class (W8.5 X D8.5 X H5.67mm).
Sony first announced the development of "Exmor R" on Jun, 2008. "Exmor R" has been incorporated in Sony’s digital imaging products since 2009, and its use in other products has continued to expand.
In this back-illuminated CMOS image sensor, light is directed onto the silicon substrate from behind, allowing light to be used with a level of efficiency not possible with conventional front-illuminated structures.
Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm). At the end of 2010, the company plans to start the mass production of "Exmor R," including those for mobile phones announced today, on cutting-edge wafer lines (with diameter of 300mm).
