Sony announced the commercialization of two new "Exmor R" back-illuminated CMOS image sensors with improved photographic performance including high sensitivity and low noise. 
In addition, Sony will launch two new lens modules equipped with these image sensors, which also include the smallest and thinnest model for mobile phones. This is also the first time that "Exmor R" is commercialized for the use in mobile phones.
"IMX081PQ" is world’s first type 1/2.8 back-illuminated CMOS image sensor which realizes 16.41 effective megapixel resolution, and adopts the industry’s smallest unit pixel size of 1.12μm achieved by the fine pixel fabrication process technology. In theory, when a unit pixel size is made smaller, there are also some issues such as color mixture among smaller unit pixels. Sony said they solved this problem by implementing a “unique” formation of photo diodes optimally designed for fine pixel structure to realize a CMOS image sensor with high resolution, high sensitivity and low noise.
"IMX105PQ" is a type 1/3.2 back-illuminated CMOS image sensor which realizes 8.13 effective megapixel resolutions for higher sensitivity and adopts a unit pixel size of 1.4μm. By embedding these highly sensitive sensors into mobile phones, including those without camera flash, users can capture high quality photos and videos even in low light settings.
Furthermore, Sony will commercialize "IU081F" and "IU105F2" compact auto-focus lens modules which include the two new "Exmor R" back-illuminated CMOS image sensors. According to Sony, these down-sized modules are “suitable and efficient for mobile phones with relatively limited space and are equipped with high performance lens which maximize the image sensors’ respective performances.”
"IU081F" is the industry’s smallest and thinnest auto-focus lens module (W10.5 X D10.5 X H7.9mm) and is equipped with the 16.41 megapixel CMOS image sensor. "IU105F2" adopts the 8.13 effective megapixel CMOS image sensor, and belongs in the industry’s smallest and thinnest size class (W8.5 X D8.5 X H5.67mm).
Sony first announced the development of "Exmor R" on Jun, 2008. "Exmor R" has been incorporated in Sony’s digital imaging products since 2009, and its use in other products has continued to expand.
In this back-illuminated CMOS image sensor, light is directed onto the silicon substrate from behind, allowing light to be used with a level of efficiency not possible with conventional front-illuminated structures.
Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm). At the end of 2010, the company plans to start the mass production of "Exmor R," including those for mobile phones announced today, on cutting-edge wafer lines (with diameter of 300mm).

Among other features are:
By year-end 2013, location information or profile information from mobile phones will be used to validate 90 percent of mobile transactions, according to 
Location of device — This is based on the phone’s location information independent of the browser (IP address), so the user does not have to have his or her mobile browser application open for this to work; the phone only needs to be turned on. Enterprises may want to check and correlate the location of the device relative to anything else they know about the user’s location through other systems they may interact with at the enterprise. For mobile phones, there are two architectures that are used to obtain location information: One relies on device information (e.g., using the GPS-API applications that the user must opt into); the other employs APIs provided through mobile network operators that don’t require the users to opt in to releasing this information.
Two weeks after 


In the second half of 2011, Avaya and Skype plan to deliver integrated unified communications and collaboration solutions for enterprises within the U.S. The integration is intended to establish federation between Avaya Aura and Skype communications platforms and both user communities, so that an Avaya end-user and Skype user can engage and interact via presence, instant messaging, voice and video. 
The company said that the ARMADA 628 is also designed to be the first mobile CPU to provide high-speed USB 3.0 connectivity, which offers 10x faster performance than USB 2.0.
According to a recent survey undertaken by the Customer Experience Foundation (CEF) on behalf of 
Other key survey findings include: